Type
| Semi-Insulated | N-Type | P-Type | NP Type | Dopant
| Fe | S, Sn | Zn | Undoped | Growth Method
| VGF | Diameter
| 2", 3", 4", 6" | Orientation
| (100)±0.5° | Thickness (µm) | 350-675um ±25um | OF/IF
| US EJ | Carrier Concentration
| - | (0.8-8)*1018 | (0.8-8)*1018 | (1-10)*1015 | Resistivity (ohm-cm) | >0.5*107 | - | - | - | Mobility (cm2/V.S.) | >1000 | 1000-2500 | 50-100 | 3000-5000 | Etch Pitch Density (/cm2) | <5000 | <5000 | <500 | <500 | TTV [P/P] (µm) | <10 | TTV [P/E] (µm) | <15 | Warp (µm) | <15 | Surface Finished
| P/P, P/E, E/E |
|